Company
executive demonstrates how to benefit from new packaging standards without
replacing existing PLCs
In
a special session on Sunday, November 2, Niels Andersen, Schneider Electric’s
vice president of global industry solutions, will show PACK EXPO 2014 attendees
how to benefit from new packaging standards without replacing existing PLCs.
During
the presentation, end users and OEMs, including CPG customers and machine
builders, will learn how to implement the new OMAC PackML standard and achieve
powerful OEE functionality without having to rip and replace existing
automation infrastructure. The solutions and techniques discussed will help end
users reduce the cost of integration while allowing for continuous performance
monitoring and improving overall equipment effectiveness.