Company
executive demonstrates how to benefit from new packaging standards without
replacing existing PLCs
In
a special session on Sunday, November 2, Niels Andersen, Schneider Electric’s
vice president of global industry solutions, will show PACK EXPO 2014 attendees
how to benefit from new packaging standards without replacing existing PLCs.
During
the presentation, end users and OEMs, including CPG customers and machine
builders, will learn how to implement the new OMAC PackML standard and achieve
powerful OEE functionality without having to rip and replace existing
automation infrastructure. The solutions and techniques discussed will help end
users reduce the cost of integration while allowing for continuous performance
monitoring and improving overall equipment effectiveness.
“The
OMAC PackML standard, traditionally implemented in a PLC, proposes a common way
to represent machine status through a defined interface, which is essential for
downtime analysis and OEE calculations,” Andersen said. “But not all PLCs have
the necessary memory, CPU or communication capabilities to accommodate the
standard. Therefore many CPG and OEM customers need new, easy-to-implement advanced
solutions and techniques as an alternative to replacing their existing
controllers. This presentation will explain what those alternatives are.”
Schneider
Electric will also demonstrate several of its packaging and OEM solutions at
booth 7130 of PACK EXPO 2014, including its recently released Wonderware OMAC
PackML solution.
WHAT: Machine Performance, OEE and OMAC PackML Made Easy
WHEN: Sunday,
November 2, 2014; 2:00 p.m. Central Time
WHERE: PACK EXPO 2014 McCormick Place,
Chicago, IL Innovation Center - N4570 North Hall, Grand Concourse
WHO: Niels Andersen, vice president, global industry solutions Schneider Electric
John Nero, Tiziani Whitmyre jnero@tizinc.com m: 401-486-3120
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