Company executive demonstrates how to benefit from new packaging standards without replacing existing PLCs
In a special session on Sunday, November 2, Niels Andersen, Schneider Electric’s vice president of global industry solutions, will show PACK EXPO 2014 attendees how to benefit from new packaging standards without replacing existing PLCs.
During the presentation, end users and OEMs, including CPG customers and machine builders, will learn how to implement the new OMAC PackML standard and achieve powerful OEE functionality without having to rip and replace existing automation infrastructure. The solutions and techniques discussed will help end users reduce the cost of integration while allowing for continuous performance monitoring and improving overall equipment effectiveness.
“The OMAC PackML standard, traditionally implemented in a PLC, proposes a common way to represent machine status through a defined interface, which is essential for downtime analysis and OEE calculations,” Andersen said. “But not all PLCs have the necessary memory, CPU or communication capabilities to accommodate the standard. Therefore many CPG and OEM customers need new, easy-to-implement advanced solutions and techniques as an alternative to replacing their existing controllers. This presentation will explain what those alternatives are.”
Schneider Electric will also demonstrate several of its packaging and OEM solutions at booth 7130 of PACK EXPO 2014, including its recently released Wonderware OMAC PackML solution.
WHAT: Machine Performance, OEE and OMAC PackML Made Easy
WHEN: Sunday, November 2, 2014; 2:00 p.m. Central Time
WHERE: PACK EXPO 2014 McCormick Place, Chicago, IL Innovation Center - N4570 North Hall, Grand Concourse
WHO: Niels Andersen, vice president, global industry solutions Schneider Electric
Contacts: Christine Lesher firstname.lastname@example.org m: 678-697-0747
John Nero, Tiziani Whitmyre email@example.com m: 401-486-3120